BHT-1000G has realized highly precise and fast speed inspection for the 100% height measurement of the gold bumps on a wafer by the scanning type white light interference method in our unique measurement

Bump Inspection SystemBump Inspection System
■Feature
  • Able to detect deformity such as abnormal projections and partial hiatus of the gold bumps.
  • User friendly software for making a recipe within 30 min.
  • High power inspection for using a small area as a base 　　level of the bump height measurement, and the three-dimensional shape measurement of the defect bump. 　　(Both of the above function are optional)
■High Precision
    　
  • Repeatability SIGMA=0.05 to 0.08 micron
■High Speed
    　
  • About 7min for 8 inch wafer 　　(absolute height measurement)
■Narrower Spacing
    　
  • No limitation by means of changing the objective lens
■Low Bump height
    　
  • No limitation
Example of the three-dimensional display of the defect bump Example of the bump height map by chips Histogram Example of the bump height distribution in a chip/div>

Measurement Method
 White light interference
Measurement Object Wafer size 6inch, 8inch
Bump size 16 micron or larger
Accuracy Repeatability sigma < 0.1micron
Measurement Time 8 inch wafer about 7 min
Equipment size （mm） 1,700 W X 1,000 D X 1,940 H

　　　・　KUBOTA COMPS Corporation

　　　　　1-1 , Hama 1-Chome,Amagasaki City Hyogo Pref 661-0967 Japan
　　　　　　TEL:+81-6-6491-0859 FAX:+81-6-6491-0899

　　　・　Information by email：info@cp.kubota.co.jp